Brief description：Thermogravimetric analyzers (TGA) reveal a material's thermal stability, composition, and filler content by measuring weight changes during programmed heating. Dehui represents the TA Instruments Discovery TGA series, which offers weighing sensitivity better than 0.1 µg and temperatures up to 1200°C. With Hi-Res dynamic heating technology, it provides fast and precise analysis, making it an indispensable tool for analyzing adhesive components.
Industry Applications：Quick determination of adhesive solid content/filler content—TGA thermal weight loss component analysis; quantification of three components in tape adhesive layer: solvent residue/resin/inorganic filler; thermal stability evaluation of silicone pressure-sensitive adhesives—high-temperature residue and decomposition temperature; TGA quantification of carbon materials in carbon nanotube/graphene-modified adhesives; TGA assessment of curing degree in structural adhesives, and more.
Detailed
Thermogravimetric analyzers (TGA) reveal a material's thermal stability, composition ratio, and filler content by precisely measuring the weight changes of a sample during programmed heating. The TA Instruments Discovery TGA series, represented by Dehui, offers weighing sensitivity better than 0.1 µg and a temperature range up to 1200°C. Combined with Hi-Res dynamic heating rate control technology, it significantly shortens analysis time without losing resolution. For the adhesive industry, TGA is the most direct method for composition analysis: stepwise weight loss curves can distinguish between volatiles (solvents, moisture), organic polymer decomposition, and residual inorganic fillers, allowing quick judgment of the resin-to-filler ratio in adhesive formulations. TGA-IR/GC-MS can further identify the evolved gases and pinpoint the chemical sources of decomposition products.
Industry Applications:
Quick determination of solid/filler content in adhesives — TGA thermal weight loss component analysis
Quantitative ratios of solvents, resins, and inorganic fillers in adhesive layers of tapes
Thermal stability evaluation of silicone pressure-sensitive adhesives — high-temperature residue and decomposition temperature
Quantification of carbon material content in CNT/graphene-modified adhesives using TGA
Evaluation of curing degree of structural adhesives — residual solvent and unreacted small molecule content
Product inquiry
