The electronics packaging materials and PCB industry require testing accuracy at least an order of magnitude higher than ordinary polymer materials. The reason is simple: a Tg deviation of 5°C, a CTE mismatch, or an inaccurate thermal conductivity test could lead to chip packaging delamination, solder joint fatigue failure, or PCB warping — in consumer electronics, it's a return; in automotive or aerospace electronics, it could pose a safety risk. 

Equipment in an electronics materials lab should focus on core parameters: Tg (glass transition temperature) — DSC can measure it, but DMA is 10-100 times more sensitive. For highly cross-linked epoxy molding compounds, measuring Tg with DMA is the industry standard. CTE (coefficient of thermal expansion) — TMA is the standard tool for measuring CTE, and both in-plane and out-of-plane CTE of PCB substrates need characterization. Thermal conductivity — LFA laser flash method is the mainstream industry method for measuring thermal conductivity of electronic packaging and thermal interface materials (TIM), covering the full range from 0.1 to 10 W/(m·K).

For rheological properties, a rotational rheometer evaluates the thixotropy and application performance of thermal grease (suitability for dispensing processes), while a capillary rheometer is used for EMC mold flow simulation. Additionally, TGA measures filler content and thermal stability, and universal testing machines measure solder joint shear force and PCB bending strength — these are standard setups.

Dehuisci (www.dehuisci.com) provides high-precision thermal analysis, rheology, and mechanical testing solutions for customers in the electronics materials and PCB industry. Phone: 0512-67071902.