Adhesives Industry — including pressure-sensitive adhesives (PSA), hot melt adhesives, epoxy structural adhesives, and UV-curable adhesives — is one of the segments in the new materials field that relies most heavily on testing equipment. A complete adhesives R&D and QC lab needs to cover at least four major types of testing: thermal properties, rheological properties, mechanical properties, and compositional analysis.

Thermal Properties Testing: DSC is the first thermal analysis instrument in an adhesives lab. It measures Tg to determine the working temperature range of the adhesive, conducts curing kinetics experiments to determine the optimal curing temperature and time, and measures OIT to evaluate thermal-oxidative stability. For UV-curable adhesives, DSC needs to be paired with a photocalorimetry accessory to simulate the UV curing process.

Rheological Properties Testing: A rotational rheometer is a core tool in adhesives R&D. Flow curves help understand application viscosity, thixotropy tests assess leveling behavior after coating, oscillatory tests provide G' and G" to determine the adhesive's viscoelastic characteristics, and yield stress tests evaluate anti-sagging performance.

Mechanical Properties Testing: Universal testing machines equipped with peel grips (180°/90°), tensile grips, and shear grips test the peel strength of adhesive tapes (GB/T 2792), tensile shear strength (GB/T 7124), and tack.

Compositional Analysis: FTIR-ATR quickly identifies the type of main resin and additives in the adhesive.

Dehuisci (www.dehuisci.com) provides complete equipment solutions for adhesives industry clients and has served international adhesive companies such as Sika and tesa. For inquiries: 0512-67071902.